| 摘要 |
PROBLEM TO BE SOLVED: To prevent encapsulation resin from becoming hindrance of linear conveyance of a hard recording medium.SOLUTION: A thermal print head 10 is provided with: an insulation substrate 22; heating resistor elements 26; a pad 65; an electrode layer 28; a bump ball 66; a drive element 42; a bonding wire 44; and resin 48. The insulation substrate 22 has: a top face 63; and a side face 64 inclined relative to the top face 63. The heating resistor elements 26 are arranged at an interval on a top face 61. The pad 65 is provided on the side face 64. The electrode layer 28 extends from the heating resistor element 26 to the pad 65. The bump ball 66 is provided on the pad 65, and its cross section draws a curve. The drive element 42 drives the heating resistor elements 26. The bonding wire 44 connects the drive element 42 with the bump ball 66. The resin 48 encapsulates the drive element 42 and the bonding wire 44. |
