| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cutting resin films, in which generation of cracks, chips, and the like can be remarkably reduced.SOLUTION: A method for cutting a resin film in which the resin film is cut with a cutting blade is provided, the method comprising a cutting step for conducting the cutting of the resin film in a state in which an auxiliary film is placed on a position where the cutting is planned to be conducted, the position being on the surface of the cutting blade side of the resin film. An elongation rate, in compliance with JIS K 7127(1999), of the auxiliary film is higher than that of the resin film. |
