| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has excellent tackiness after dried and photosensitivity, thereby, which can be micro-processed, which gives a cured film having excellent flexibility, flame retardancy and reliability of electric insulation, and which reduces warpage of a substrate after cured, and to provide a resin film, a cured film and a printed wiring board with a cured film.SOLUTION: The photosensitive resin composition comprises at least (A) a binder polymer, (B) crosslinked polymer particles encapsulating a flame retardant, (C) a radical polymerizable compound, and (D) a photopolymerization initiator. |
