| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which reduces a flat dimension while suppressing increase in a thickness and needs not be concerned about an adverse impact of an IC caused by heat generated by an inductor.SOLUTION: A semiconductor device manufacturing method comprises arranging an encapsulation body 11 in which an electronic component is mounted on a main face MF side of a lead frame RM and an inductor 12 is mounted on a back face BF side in a mold and resin encapsulating the encapsulation body 11 to form a resin body 12. At this time, a salient T along a direction orthogonal to a resin injection direction is provided at a predetermined position closer to a resin injection port G than the electronic component, among a surface side mold internal surface KF for molding a resin body part 14p. The encapsulation body 11 is arranged and resin encapsulated such that a distance LB from a back face side mold internal surface KB to a surface 12s of the inductor 12 becomes greater than a distance from the surface side mold internal surface KF to a surface 22cf of the electronic component and not greater than a predetermined distance. |
