发明名称 COMPONENT INSPECTION METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To determine the state of an electronic component, before being sucked by a suction nozzle, easily and at a high speed.SOLUTION: A component inspection method includes an image acquisition step for acquiring an image including a current suction position and a previous suction position, when sucking a component housed in the component housing section of a carrier tape by means of a suction nozzle and transferring the component to a predetermined component mounting position, first comparison step for comparing the brightness of the first window of an image including the current suction position with a preset first threshold, and first determination step for determining whether a component in the component housing section is showing the front side or not.
申请公布号 JP2014072409(A) 申请公布日期 2014.04.21
申请号 JP20120217896 申请日期 2012.09.28
申请人 JUKI CORP 发明人 NAKANISHI YUKA;KONNO TAKASHI
分类号 H05K13/08;H05K13/04 主分类号 H05K13/08
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