| 摘要 |
PROBLEM TO BE SOLVED: To prevent reduction of reliability by preventing deterioration of manufacture yield in a wiring board with components incorporated therein in which components are built in the wiring board.SOLUTION: In a single wiring board core, a plurality of wiring layers is laminated via insulation layers, respectively, and electrically connected by an inter-layer connection body and a plurality of through holes is formed. On a mold releasing film, the single wiring board core is disposed by being affixed to a viscous agent formed on a top face of the mold releasing film. In the through hole formed between the wiring board cores, an electronic component is then disposed so as to be affixed to the viscous agent on the mold releasing film, and on the wiring board core, a prepreg with which a wiring layer is formed on at least one side thereof so as to close an opening of the through hole is laminated so as to be positioned closer to the wiring board core side. A laminate formed from the mold releasing film, the wiring board core and the prepreg is then heated, a gap formed between the electronic component disposed within the through hole and the through hole is filled with a resin in the prepreg, and the mold releasing film is then exfoliated. |
