| 摘要 |
PROBLEM TO BE SOLVED: To extend an insulation distance from an upper surface of a casing exposed between a wiring substrate and a module substrate to a contact part.SOLUTION: A power connection structure S1 is constituted by a wiring substrate 10 disposed on a casing C in the periphery of a module substrate 4 and connectors 20p, 20m including connect parts 25 which conductively connect printed wires 13p, 13m of the wiring substrate 10 and electrodes 6p, 6m of the module substrate 4. Insulation projection parts 32 which are nonconductors and project to the module substrate 4 side so as to straddle between an upper surface of the wiring substrate 10 and an upper surface of the module substrate 4 right under the connect parts 25 are provided on lower parts of the connectors 20p, 20m. Therefore, an insulation distance L connecting from the upper surface of the casing C exposed between the wiring substrate 10 and the module substrate 4 to the connect part 25 with the shortest line without passing through the nonconductor can be extended by bypassing the insulation projection part 32. |
