| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component capable of improving the retaining performance with solder, and stabilizing mountability after reflow.SOLUTION: A chip resistor 1 includes: a substrate 2; an element 5 containing a plurality of resistors R formed on the substrate 2; and a first connection electrode 3 and a second connection electrode 4 for externally connecting the element 5. The first connection electrode 3 and the second connection electrode 4 include an electrode in which irregularities 12 and 17 obtained by alternately arranging recesses 10 and 15 notched in the thickness direction and protrusions 11 and 16 neighboring to the recesses 10 and 15 in the peripheral edge part are formed. |
