| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which quells concerns for malfunction of an IC caused by an electromagnetic field generated by an inductor.SOLUTION: A semiconductor device 10 comprises: a lead frame RM; an MIC 18 mounted on a main face MF side of the lead frame RM; an inductor 12 mounted on a back face BF side of the lead frame RM; and a resin body 14 for resin encapsulating the lead frame RM, the MIC 18 and the inductor 12. The inductor 12 is an octagonal prism-shaped core of a ferromagnetic material. The MIC 18 is arranged at a position corresponding to an axis P of the inductor 12. |
