发明名称 |
THERMAL TREATMENT APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermal treatment apparatus in which a delivery operation of a substrate between treatments is reduced.SOLUTION: A thermal treatment apparatus 100 includes a stage 20 for holding a substrate W. A heat treatment plate 22 of the stage 20 is provided with a heater 23 and a cooling mechanism 24. A substrate delivery part 10 delivers the unprocessed substrate W to the stage 20, and the stage 20 subjects the substrate W to alignment processing and a preheating treatment. The stage 20 then rises to a position facing a lamp house 50 and a flash lamp FL irradiates the substrate W with flash light. The stage 20 then descends and the substrate W is subjected to a cooling treatment on the stage 20. All treatments relating to a flash heating treatment are executed while the substrate W is held by the stage 20, thereby eliminating delivery of the substrate W between the respective treatments, thus eliminating the need for a transfer robot for transferring the substrate W between the respective treatments to allow an increase in footprint of the thermal treatment apparatus 100 to be suppressed. |
申请公布号 |
JP2014072352(A) |
申请公布日期 |
2014.04.21 |
申请号 |
JP20120216930 |
申请日期 |
2012.09.28 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
SHIBUTA KOJI;KIMURA TAKAHIRO;KUWATA YUTAKA;KUSUDA TATSUFUMI |
分类号 |
H01L21/26;G02F1/1368;H01L21/683 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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