发明名称 THERMAL TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thermal treatment apparatus in which a delivery operation of a substrate between treatments is reduced.SOLUTION: A thermal treatment apparatus 100 includes a stage 20 for holding a substrate W. A heat treatment plate 22 of the stage 20 is provided with a heater 23 and a cooling mechanism 24. A substrate delivery part 10 delivers the unprocessed substrate W to the stage 20, and the stage 20 subjects the substrate W to alignment processing and a preheating treatment. The stage 20 then rises to a position facing a lamp house 50 and a flash lamp FL irradiates the substrate W with flash light. The stage 20 then descends and the substrate W is subjected to a cooling treatment on the stage 20. All treatments relating to a flash heating treatment are executed while the substrate W is held by the stage 20, thereby eliminating delivery of the substrate W between the respective treatments, thus eliminating the need for a transfer robot for transferring the substrate W between the respective treatments to allow an increase in footprint of the thermal treatment apparatus 100 to be suppressed.
申请公布号 JP2014072352(A) 申请公布日期 2014.04.21
申请号 JP20120216930 申请日期 2012.09.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 SHIBUTA KOJI;KIMURA TAKAHIRO;KUWATA YUTAKA;KUSUDA TATSUFUMI
分类号 H01L21/26;G02F1/1368;H01L21/683 主分类号 H01L21/26
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