发明名称 TRANSFER MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a transfer molding device capable of enhancing production efficiency per unit time by performing preheat processing in parallel with other processing.SOLUTION: There is provided a transfer molding device which comprises: a feed processing part 10 for feeding a resin plate J1 to a bucket 80; a vacuum processing part 20 for sucking air inside the bucket 80; heat processing parts 30 and 40 for heating and pressing the bucket 80; a cooling processing part 50 for cooling the bucket 80; a sending processing part 60 for sending a resin plate J2 from the bucket 80; an intermittent rotation part 70 for intermittently rotating the bucket 80 while supporting the bucket 80; and bucket opening and closing means for opening and closing the bucket 80, wherein the processing parts 10 to 60 are each independently provided and arranged on the circumference and each of processes is simultaneously performed for different buckets 80. The vacuum processing part 20 performs preheat processing for preheating the bucket in parallel with air suction processing. The processing in all of the processing parts 10 to 60 is performed by one rotation of the intermittent rotation part 70 and an uneven pattern is transfer-molded on the resin plate J2.
申请公布号 JP2014069547(A) 申请公布日期 2014.04.21
申请号 JP20120219824 申请日期 2012.10.01
申请人 IDEMITSU UNITECH CO LTD 发明人 NANBA YOSHINORI;TACHI SEIYA
分类号 B29C59/02;H01L21/027 主分类号 B29C59/02
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