| 摘要 |
A photosensitive resin composition comprises a photopolymerization initiator and a carboxyl group-containing photosensitive resin obtained by reacting a phenol resin and an alkylene oxide or cyclocarbonate compound, reacting the resulting reaction product with an iosocyanate compound which has one or more acrylamide groups or methacrylamide groups or one or more acryloyl groups or methacryloyl groups per molecule, and reacting the resulting reaction product with a polybasic acid anhydride. Preferably the composition further comprises a thermosetting component. By using said photosensitive resin composition or a dry film thereof, it is possible to form a cured film having the PCT resistance, HAST resistance, electroless gold plating resistance, and cold-hot impact resistance required in a solder resist for a printed wiring board, particularly a semiconductor package. |
