| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for changing specification of one semiconductor chip in the case where dummy bumps are formed between semiconductor chips which are opposite to each other and when specification of an arrangement of dummy bumps on the other semiconductor chip is changed.SOLUTION: A semiconductor device comprises: a first semiconductor chip 1 and a second semiconductor chip 2 which are stacked to be electrically connected with each other; first functional bumps 31 which are formed on the first semiconductor chip 1 and contribute to electrical connection and second functional bumps 32 which are formed on the second semiconductor chip 2 and contribute to electrical connection in which the first functional bumps 31 and the second functional bumps 32 are arranged in contact with each other and opposite to each other; and dummy bumps 41 which are formed only on the first semiconductor chip 1 and do not contribute to electrical connection, and which are in contact with a surface protection film 22 of the second semiconductor chip 2. |
