发明名称 LED ELEMENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To realize an LED element based on a nitride semiconductor capable of preventing damage to a luminous layer during wire bonding, having high luminous efficiency, and operating with low voltage.SOLUTION: An LED element 1 comprises: a support substrate 11; a conductive layer 20 formed on the top layer of the support substrate 11; an insulation layer 21 formed on part of the top surface of the conductive layer 20, and having a bottom surface that is in contact with the part; a first semiconductor layer 31 configured with a p-type nitride semiconductor, formed on part of the top surface of the conductive layer 20 and part of the top surface of the insulation layer 21, and having a bottom surface that is in contact with the part; a luminous layer 33 configured with a nitride semiconductor and formed on the top layer of the first semiconductor layer 31; a second semiconductor layer 35 configured with an n-type nitride semiconductor, formed on part of the top surface of the luminous layer 33 and part of the top surface of the insulation layer 21, having a bottom surface that is in contact with the part, and having a greater expanse in the horizontal direction than the first semiconductor layer 31 and the luminous layer 33; and a bonding electrode 43 formed on the top surface of the second semiconductor layer 35 at a position directly above an area where the bottom surface of the second semiconductor layer 35 and the top surface of the insulation layer 21 are in contact with each other.
申请公布号 JP2014072419(A) 申请公布日期 2014.04.21
申请号 JP20120218034 申请日期 2012.09.28
申请人 USHIO INC 发明人 TSUKIHARA MASASHI;KAWASAKI KOJI
分类号 H01L33/14 主分类号 H01L33/14
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