| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high arrangement efficiency of through vias.SOLUTION: In a semiconductor device in which semiconductor chips are stacked and adjacent semiconductor chips are electrically connected by a plurality of through vias 805, each semiconductor chip has a core circuit and a plurality of IO circuits disposed therearound, the through vias 805 are disposed in the core circuit, and the arrangement pitch of the through vias 805 is integral multiple of the cell pitch of a library constituting the core circuit. |
