发明名称 COOLING DEVICE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus in which a cooling measure and a shield measure are taken and the thickness is reduced.SOLUTION: A cooling device includes a heat dissipation part provided in one end of a heat transfer member, a heat receiving plate provided in the other end of the heat transfer member and disposed so as to face a noise generation component mounted on a circuit board and thermally connected to the noise generation component, and a shield part provided on a side of the other end of the heat transfer member, and covering the noise generation component. The shield part includes the heat receiving plate formed by drawing a sheet metal, and a peripheral wall part continuously provided in the heat receiving plate. This structure provides an electronic apparatus in which a cooling measure and a shield measure are taken and the thickness is reduced.
申请公布号 JP2014072333(A) 申请公布日期 2014.04.21
申请号 JP20120216610 申请日期 2012.09.28
申请人 FUJITSU LTD 发明人 YAMAGUCHI TSUYOKI;KOBAYASHI SONOMASA
分类号 H05K7/20;H01L23/00;H01L23/427;H01L23/467;H05K9/00 主分类号 H05K7/20
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