| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor wafer to be successfully fixed to a base and enables the base to be easily separated from the semiconductor wafer.SOLUTION: A semiconductor device manufacturing method comprises: a process of preparing an adhesive sheet which has a first adhesive layer and a second layer having an adhesive force lower than that of the first adhesive layer, and a peripheral part of the adhesive sheet is formed by the first adhesive layer and a central part inside the peripheral part is formed by lamination of the first adhesive layer and the second adhesive layer; a process of fixing a semiconductor wafer to a base by using the adhesive sheet; and a process of cutting the first adhesive layer to separate the base from the semiconductor wafer. |
