发明名称 A METHOD FOR BONDING SUBSTRATES USING A UV RADIATION CURING-REDOX CURING ADHESIVE SYSTEM
摘要 <p>The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.</p>
申请公布号 KR20140047072(A) 申请公布日期 2014.04.21
申请号 KR20147001205 申请日期 2012.07.18
申请人 HENKEL CHINA CO., LTD. 发明人 ATTARWALA SHABBIR;ZHOU NICOLAS;YUAN JIMMY;LU DANIEL;SONG CHONGJIAN
分类号 B32B37/12;G06F3/044 主分类号 B32B37/12
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