| 摘要 |
FIELD: radio engineering, communication.SUBSTANCE: invention relates to radioelectronics and can be used to solve problems of removing heat from heat-loaded radioelectronic components on printed-circuit boards. In the disclosed radioelectronic unit, a heat-loaded radioelectronic component 3 is mounted on the outermost printed-circuit board 2, where said component is fitted with a heat-conducting plate 4 with fins 5 and grooves 6 in which fins 7 and grooves 8 of a heat-conducting cover 1 are inserted, respectively, when assembling the radioelectronic unit, and gaps between the fins 5 and 7 are filled with heat-conducting material 9.EFFECT: high efficiency of removing heat from heat-loaded radioelectronic components.1 dwg |
