| 摘要 |
<p>Interconnection device for electronic circuits, notably microwave electronic circuits, characterized in that it comprises at least one transmission line coupled to an earth line, the two lines being made on a face of a dielectric substrate, at least one metallization surface forming on the other face of the dielectric substrate at least one coupling element disposed on a surface substantially equal in area to the surface occupied by the transmission line and the earth line, the interconnection being carried out substantially at the level of the ends of the transmission line and of the earth line.</p> |
