| 摘要 |
PROBLEM TO BE SOLVED: To reduce failure caused by thermal stress and to achieve a surface mounting structure whose configuration is simple.SOLUTION: A plurality of electrodes (2) of a chip component (1) are joined to different lands. A wiring pattern (4a) having a first land has a convex shape having a convex portion in the direction parallel to the surface of a printed board (5), and the wiring pattern (4b) having a second land has a recessed shape having a recessed portion in the direction parallel to the surface of the printed board (5). |
