发明名称 CURABLE WHITE INSULATING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable white insulating resin composition capable of attaining a cured film excellent in adhesion to a base material and superior in surface smoothness and solvent resistance.SOLUTION: The curable white insulating resin composition includes (A) a compound having no silyl group and having one or more (meth)acrylic groups in the molecule, (B) a photoinitiator, (C) a silane coupling agent having an ethylenic unsaturated bond, in an amount of 20-40 pts.mass to 100 pts.mass of the (A) component, and (D) titanium oxide, and is characterized in that the (A) component contains a compound having two or more (meth)acrylic groups in the molecule, in an amount of 50 wt.% or more.
申请公布号 JP2014065855(A) 申请公布日期 2014.04.17
申请号 JP20120213478 申请日期 2012.09.27
申请人 TAMURA SEISAKUSHO CO LTD 发明人 TANIGUCHI YASUAKI;OKAMOTO YOSHIO
分类号 C08F2/44;C08F292/00;H05K1/03 主分类号 C08F2/44
代理机构 代理人
主权项
地址