| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of an airtight sealed package the inside of which is held airtight, and a method of manufacturing the same.SOLUTION: An airtight sealed package includes a ceramic substrate 3 on which an infrared detection element 1 is mounted; an infrared transmissive window 4 which is connected to the substrate 3 and forms a cavity part 2 including the element 1 with the substrate 3; first metallized layers 6a, 6b which are connected with a solder material 5; second metallized layers 7a, 7b which are connected with a solder material 5, and a resistor 8. The first metallized layers 6a, 6b are formed continuously on two mutually opposite surfaces of the substrate 3 and the window 4 over the entire periphery of the cavity part 2. The second metallized layers 7a, 7b are formed in island shapes on both or one of the two mutually opposite surfaces of the substrate 3 and the window 4 at a periphery of the cavity part 2. The resistor 8 is installed in the substrate 3 opposite at least the second metallized layers 7a. |
