| 摘要 |
PROBLEM TO BE SOLVED: To provide a print wiring board with an adhesive sheet that is likely to have a fine wiring pattern or small via diameter with an easy alignment when forming a bottomed via in an adhesive sheet, and that can be used regardless of an aspect ratio of the print wiring board, and to provide a manufacturing method of the same and a manufacturing method of a laminated print wiring board using the same.SOLUTION: A print wiring board with an adhesive sheet includes a print wiring board having a flat connection terminal, a thermosetting adhesive sheet comprising a protective film and an adhesive material and temporarily adhered on the print wiring board, a bottomed via for interlayer connection penetrating through the adhesive sheet across the flat connection terminal, a conductive paste filled in the bottomed via and tentatively hardened, and a cavity opening penetrating through the adhesive sheet and the print wiring board for housing electronic component elements. There are also provided a manufacturing method of the same, and a manufacturing method of a laminated print wiring board using the same. |
