发明名称 |
BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF FORMING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide bump structures.SOLUTION: Provided are: a body portion separate from a pad disposed on a substrate; and at least one first extension extending from a side of the body portion onto the pad. Also provided is at least one second extension extending from another side of the body portion. The width of the first extension is smaller than the width of the body portion. |
申请公布号 |
JP2014068015(A) |
申请公布日期 |
2014.04.17 |
申请号 |
JP20130197965 |
申请日期 |
2013.09.25 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHO MOON GI;KIM YOUNG LYONG;PARK SUN-HEE;LIM HWAN-SIK |
分类号 |
H01L21/60;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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