| 摘要 |
Provided is a multilayer wiring board, wherein impedance matching can be achieved in a via connection section by means of a configuration, which has a simple structure, and which can be easily processed. In the multilayer wiring board including a ground layer (401) of a layer (1), and a signal line (102) of a layer (2), an elliptical through hole is formed in the ground layer (401), said through hole being at a position facing a part of the signal line (102). The elliptical through hole overlaps the signal line (102) by a length of lambda/36-lambda/2 in the long axis direction, Impedance of the signal line (102) can be adjusted by adjusting the size of the through hole. |
