| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a piezoelectric vibration element capable of achieving high density mounting and low cost without degrading the reliability of airtight sealing, a piezoelectric device, and a method of manufacturing the piezoelectric device.SOLUTION: A package for a piezoelectric vibration element includes; an insulating base 101 having an upper surface and a lower surface; a first recess 102 provided on the upper surface and housing a first piezoelectric vibration element 104; a second recess 103 provided on the lower surface and housing a second piezoelectric vibration element 105; a frame-shaped metalization layer 109 formed on the upper surface of the insulating base 101 and surrounding the first recess 102; and a through hole 106 provided in the insulating base 101 between a bottom surface of the first recess 102 and a bottom surface of the second recess 103. The first recess 102 and the second recess 103 are simultaneously vacuumed by the through hole 106, thereby achieving high density mounting and low cost while the degree of vacuum is increased. |
