| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a solder fillet is formed even in a lead part end surface via an upper surface portion of the lead part exposed from an encapsulation resin portion when the semiconductor device is bonded to a mounting substrate such as a printed board by means of a solder bonding agent, even when no plated layer exists on the lead part end surface, and to provide a method of manufacturing the semiconductor device.SOLUTION: There is provided a resin-encapsulated semiconductor device which includes: a semiconductor element mounted on a die pad part; a plurality of lead parts whose front end parts are arranged so as to be opposed to the die pad part; a thin metal wire connecting between an electrode of the semiconductor element and the lead parts; and encapsulation resin partially encapsulating them with the resin. A bottom face part of the die pad part, and a bottom face part, an outside surface part and an upper side end part of the lead part are exposed from the encapsulation resin. A plated layer is formed on the exposed lead bottom face part and the lead upper side end part. |
