| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which includes a plating filled via conductor achieving high connection reliability and can form a fine conductor pattern.SOLUTION: In a manufacturing method of a printed wiring board, a metal layer 53, an electroless plating layer 52, and an electrolytic plating layer 56 are formed on a metal foil 48. Subsequently, the electroless plating layer 52, the electrolytic plating layer 56, and the metal layer 53 are removed to expose the thin metal foil 48 having a uniform thickness and then form conductor patterns 48, 58 by etching. Thus, the manufacturing method of the printed wiring board enables a plating filled via conductor 60 and the thin conductor patterns 48, 58 to be concurrently formed and enables a fine pitch of the printed wiring board. |
