| 摘要 |
A combination RF filter and printed circuit board assembly wherein the RF filter is defined by a block of dielectric material including at least first and second side surfaces. A metal bracket with a plurality of fingers is secured to each of the first and second side surfaces. The fingers on the brackets extend through respective apertures in the printed circuit board and are soldered to the printed circuit board. The brackets relieve and transfer the thermal and mechanical stresses that result from use of a filter and printed circuit board that are made of materials with different thermal and mechanical characteristics and reduce the risk of cracking or damage to the filter, the printed circuit board, and the solder joints during use. |
