| 摘要 |
<p>A light emitting diode package according to the present invention includes a metal lead frame and a light emitting diode chip which is mounted on the metal lead frame. The metal lead frame includes a metal housing which is composed of a metal clad layer on which two or more different metal layers are stacked, a lead which is integrated with at least one metal layer located on the lower side of the metal clad layer and is electrically connected to the light emitting diode chip or an external circuit board, and an insulating member which insulates the lead from the metal housing.</p> |
