| 摘要 |
PROBLEM TO BE SOLVED: To provide a planarization method of tape slack of a frame unit which, after expanding an expanding tape of the frame unit formed by bonding the wafer through the expanding tape to an annular frame, planarizes the tape slack occurs in the expanding tape of a wafer outer periphery.SOLUTION: A planarization method of tape slack of a frame unit carries out an expansion maintenance step in which a chip interval is extended by expanding an expanding tape, and an annular member is fixed to an adhesive face of the expanding tape while applying a negative pressure to the expanding tape, to maintain an expansion of the expansion tape. The expansion of the expanding tape is cancelled after carrying out the expansion maintenance step to generate a raised portion in which an excess portion of the expanding tape is raised. The raised portion is sandwiched between an annular heating member and a holding surface of a chuck table so that the raised portion of the expanding tape is crushed to be fixed by thermal compression bond. |
