| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board in which a conductor layer having high adhesion strength can be formed on a roughened surface by plating although the roughness of the surface of an insulating layer after roughening processing is relatively small.SOLUTION: In a state that a thermosetting resin composition layer is laminated on one surface or both surfaces of an inner layer circuit board, a water-soluble polymer layer is laminated on the thermosetting resin composition layer, and a support layer is laminated on the water-soluble polymer layer, the thermosetting resin composition layer is thermally cured to form an insulating layer. In a process of roughening a surface of the insulating layer with an alkaline oxidizing agent after the support layer is removed, the surface of the insulating layer is roughened and the water-soluble polymer layer is removed, and a conductor layer is formed on the roughened surface of the insulating layer by plating. |
