发明名称 |
DIVIDING METHOD AND SCRIBING DEVICE OF BRITTLE MATERIAL SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a scribing device capable of simply dividing a thin brittle material substrate at a low cost when especially, divided.SOLUTION: A method for dividing a brittle material substrate G along a predetermined division line comprises: the first step of closely contacting a first substrate G1 with a second substrate G2 having a linear expansion coefficient larger than that of the first substrate G1 and placing them on a work table; the second step of forming initial cracks in the first substrate G1; the third step of irradiating and heating the substrate having the formed initial cracks with a laser beam along the predetermined division line, and forming cracks inside the first substrate G1 and the second substrate G2 along the predetermined division line; and the fourth step of pressing both sides of the predetermined division line to divide the first substrate G1 and the second substrate G2 along the predetermined division line. |
申请公布号 |
JP2014065630(A) |
申请公布日期 |
2014.04.17 |
申请号 |
JP20120211971 |
申请日期 |
2012.09.26 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
IKEDA TSUYOSHI;YAMAMOTO KOJI |
分类号 |
C03B33/09;B23K26/364;B28D5/00 |
主分类号 |
C03B33/09 |
代理机构 |
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代理人 |
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地址 |
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