| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit the occurrence of insulation failure.SOLUTION: A semiconductor device 1 comprises: a lead frame 10 surrounded by a frame body 30; and an electrodeposition coating film 40 on a lateral face 13 of the lead frame 10 and an electrodeposition coating film 50 on an inner surface 33a of the frame body 30, which are integrally formed. For this reason, a boundary surface between the electrodeposition coating film 40 and an encapsulation resin body 60 is not exposed, so that insulation failure caused by water immersion from the boundary surface between the electrodeposition coating film 40 and the encapsulation resin body 60 does not occur. Further, the semiconductor device 1 comprises a recess 34 formed in an exposed part on a top face 31 of the frame body 30. For this reason, by filling the recess 34 with the encapsulation resin body 60, adhesion between the frame body 30 and the encapsulation resin body 60 is improved. As a result, insulation failure caused by water immersion from a boundary surface between the electrodeposition coating film 50 and the encapsulation resin body 60 can be inhibited. |
