| 摘要 |
Disclosed herein are a hybrid lamination substrate and a manufacturing method thereof. The hybrid lamination substrate includes: a core layer; at least one first insulating layer that is made of a photosensitive resin material and is formed on an upper portion, a lower portion, or upper and lower portions of the core layer; and at least one second insulating layer that is made of a non-photosensitive resin material and is formed on the upper portion, the lower portion, or the upper and lower portions of the core layer. Further, a package substrate including the same and a manufacturing method of a hybrid lamination substrate are proposed. |
