| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method and a pattern forming apparatus capable of easily forming a thick pattern by using an inkjet process in such an application that a resin is not allowed to be used as a binder or only a small amount of a resin is allowed to be used, for example, for forming a pattern of a conductive, semiconducting or optically functional material.SOLUTION: The pattern forming method is carried out by dropping ink onto a substrate by an inkjet process, in which the substrate includes a first region and a second region having different levels of surface energy. At least two types of ink, a first ink having volatilizing property and a second ink having curing property are used for the ink. The first ink and the first region are lyophilic to each other, while the second ink and the second region are lyophilic to each other. The pattern forming method includes a dropping step of simultaneously dropping the first ink onto the first region and the second ink onto the second region by a multipath system. |
