| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module that has high positioning accuracy between circuit boards having a semiconductor element and a base, and is downsized.SOLUTION: A semiconductor module includes a base and a plurality of circuit boards. Each of the plurality of circuit boards has a supporting substrate, and a semiconductor element provided on a primary surface of the supporting substrate and electrically connected to the primary surface of the supporting substrate. The base and/or the supporting substrate have/has a structure to fit the supporting substrate into the base. The primary surfaces of the adjacent supporting substrates are disposed at different positions to each other in the depth direction of the supporting substrates. |
