发明名称 WIRING BOARD AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which achieves high mounting reliability and an electronic apparatus.SOLUTION: A wiring board 1 of this invention includes: an insulation substrate 2; a conductor electrode 3 provided on the insulation substrate 2; a main conductor layer 4 which is provided on the conductor electrode 3; a coating metal layer 5; and a corrosion prevention layer 6. The coating metal layer 5 is provided on the main conductor layer 4 so as to cover the main conductor layer 4. The main conductor layer 4 has an exposed part 4a exposed from the coating metal layer 5. The corrosion prevention layer 6 is formed at the exposed part 4a.
申请公布号 JP2014067892(A) 申请公布日期 2014.04.17
申请号 JP20120212560 申请日期 2012.09.26
申请人 KYOCERA CORP 发明人 KAMASE HIROSHI;TODO KIMINARI
分类号 H05K3/24 主分类号 H05K3/24
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