发明名称 GROUND CONTACT OF AN INTEGRATED CIRCUIT TESTING APPARATUS
摘要 A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.
申请公布号 US2014103952(A1) 申请公布日期 2014.04.17
申请号 US201313848209 申请日期 2013.03.21
申请人 JF MICROTECHNOLOGY SDN. BHD. 发明人 KUONG FOONG WEI;SING GOH KOK;MUNDIYATH SHAMAL
分类号 G01R1/067 主分类号 G01R1/067
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