发明名称 METHOD FOR PARTING LAMINATED CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To part a laminated ceramic substrate obtained by laminating a metal film on a ceramic substrate.SOLUTION: Groove processing is performed to a metal film 12 of a laminated ceramic substrate 10 along a line to be scribed, using a patterning tool. A scribe line is formed on a ceramic substrate 11 by means of a scribe device from a surface of the ceramic substrate 11. Break is performed along the scribe line from the surface on the ceramic substrate 11 side. Thus, the laminated ceramic substrate 10 can be perfectly parted.
申请公布号 JP2014067858(A) 申请公布日期 2014.04.17
申请号 JP20120212191 申请日期 2012.09.26
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKEDA MASAKAZU;MURAKAMI KENJI;TAMURA KENTA
分类号 H05K3/00;B28D5/00 主分类号 H05K3/00
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