发明名称 METHOD OF PRODUCING SEALING BODY, AND SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of producing a sealing body having high airtightness, and a sealing device that can produce the sealing body having high airtightness.SOLUTION: A temperature of a substrate overlapped with a flit glass layer heated by an energy beam is measured, and an output of the energy beam is adjusted so that the temperature is within a predetermined temperature range. Therefore, a temperature of the flit glass layer becomes higher than the predetermined temperature range, and cracks to the substrate and the like can be prevented. In addition, it is prevented that the temperature of the flit glass layer becomes lower than the predetermined temperature range, and that deposition with the glass substrate becomes insufficient. As a result, a sealing body having high airtightness can be obtained.
申请公布号 JP2014067484(A) 申请公布日期 2014.04.17
申请号 JP20120209755 申请日期 2012.09.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NEI TAKAMASA;NAKAMURA DAIKI
分类号 H05B33/04;H01J9/26;H01J29/86;H01L51/50;H05B33/10 主分类号 H05B33/04
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