| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board with a cavity capable of achieving high density even in a simple step.SOLUTION: A method for manufacturing a multilayer wiring board comprises the steps of: forming a core substrate A including conductor patterns (L1) and (L2) provided on the front and back of an insulating layer A (step P1); arranging a binding material on the conductor pattern (L2) side of the core substrate A (step P2); forming a cavity opening penetrating the core substrate A (step P3); forming a core substrate B including conductor patterns (L3) and (L4) provided on the front and back of an insulating layer B (step P4); bonding the conductor pattern (L2) side of the core substrate A and the conductor pattern (L3) side of the core substrate B via the bonding material (step P5); and forming a non-through via A reaching the conductor pattern (L2) from the conductor pattern (L1) and a non-through via B reaching the conductor pattern (L2) from the conductor pattern (L4) (step P6). |
