发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining a high withstand voltage and a stable threshold value, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device includes a structure, an insulating film, and a control electrode. The structure has a first surface and includes a first semiconductor region containing silicon carbide of a first conductivity type, a second semiconductor region containing silicon carbide of a second conductivity type, and a third semiconductor region containing silicon carbide of the first conductivity type. The structure has a portion in which the first semiconductor region, the second semiconductor region, and the third semiconductor region are arranged in a first direction along the first surface in this order. The insulating film is provided on the first surface. The control electrode is provided on the insulating film. The structure has a buried region provided between the second semiconductor region and the first surface. In the buried region, a group-V element is introduced.
申请公布号 JP2014067927(A) 申请公布日期 2014.04.17
申请号 JP20120213161 申请日期 2012.09.26
申请人 TOSHIBA CORP 发明人 SHIMIZU TATSUO;SHINOHE TAKASHI
分类号 H01L29/78;H01L21/336;H01L29/12;H01L29/739 主分类号 H01L29/78
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