发明名称 MODULE SUBSTRATE FIXING MECHANISM
摘要 PROBLEM TO BE SOLVED: To provide a module substrate fixing mechanism arranged so that even a minute extraction can be found easily, while preventing a substrate from being extracted when a work cloth etc. is caught, for example.SOLUTION: A module substrate fixing mechanism includes a claw buried in the chassis, and recesses formed at the upper and lower ends of a module substrate to be mounted on the chassis. The claw includes a claw plate having a tip projecting into a guide groove of the chassis and being fitted in the recess, an arm plate formed substantially orthogonally to the claw plate and integrally therewith, and a swinging pin provided between the claw plate and the arm plate, and allowing the integrated claw plate and arm plate to swing.
申请公布号 JP2014067978(A) 申请公布日期 2014.04.17
申请号 JP20120214182 申请日期 2012.09.27
申请人 NEC CORP 发明人 TAKADA TERUNORI
分类号 H05K7/14 主分类号 H05K7/14
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