SIC MOSFET WITH TRENCH STRRUCTURES AND THEIR FABRICATION METHOD
摘要
<p>The present invention relates to an SiC MOSFET having a trench and a manufacturing method thereof. According to one embodiment of the present invention, the SiC MOSFET having a trench and the manufacturing method thereof include a first step of etching a trench in a SiC substrate; a second step of vertically ion-injecting vanadium into the SiC substrate; a third step of ion-injecting nitrogen into a trench sidewall; and a forth step of forming a trench gate structure.</p>
申请公布号
KR101386132(B1)
申请公布日期
2014.04.17
申请号
KR20120116520
申请日期
2012.10.19
申请人
KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
发明人
JOO, SUNG JAE;KANG, IN HO;KIM, SANG CHEOL;NA, MOON KYONG;MOON, JEONG HYUN