发明名称 SIC MOSFET WITH TRENCH STRRUCTURES AND THEIR FABRICATION METHOD
摘要 <p>The present invention relates to an SiC MOSFET having a trench and a manufacturing method thereof. According to one embodiment of the present invention, the SiC MOSFET having a trench and the manufacturing method thereof include a first step of etching a trench in a SiC substrate; a second step of vertically ion-injecting vanadium into the SiC substrate; a third step of ion-injecting nitrogen into a trench sidewall; and a forth step of forming a trench gate structure.</p>
申请公布号 KR101386132(B1) 申请公布日期 2014.04.17
申请号 KR20120116520 申请日期 2012.10.19
申请人 KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE 发明人 JOO, SUNG JAE;KANG, IN HO;KIM, SANG CHEOL;NA, MOON KYONG;MOON, JEONG HYUN
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
代理机构 代理人
主权项
地址