An image sensor chip includes a first wafer and a second wafer. The first wafer includes an image sensor having a plurality of sub-pixels, each of which is configured to detect at least one photon and output a sub-pixel signal according to a result of the detection. The image processor is configured to process sub-pixel signals for each sub-pixel and generate image data. The first wafer and the second wafer are formed in a wafer stack structure.
申请公布号
US2014104473(A1)
申请公布日期
2014.04.17
申请号
US201314051993
申请日期
2013.10.11
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM TAE CHAN;KIM MIN HO;MIN DONG KI;SUL SANG CHUL;OH TAE SEOK;LEE KWANG HYUN;LEE TAE YON;JUNG JUNG HOON;JIN YOUNG GU