| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of preventing wafer breakage when peeling a support member from a thinly ground wafer.SOLUTION: A wafer processing method comprises the steps of: a first sticking step of bringing one adhesive layer (A1) of a double-sided adhesive tape (DT) including adhesive layers (A1, A2) to a surface (W1) of a wafer (W) and sticking the double-sided adhesive tape to the wafer; a second sticking step of bringing a surface (S1) of a metallic support member (S) into contact with the other adhesive layer (A2) of the double-sided adhesive tape and sticking the support member to the wafer while curving the support member within an elastically deformable range; a grinding step of thinning the wafer to a prescribed finishing thickness (t) by grinding a rear surface (W2) of the wafer; an adhesive layer curing step of reducing an adhesive force by curing the adhesive layer of the double-sided adhesive tape by irradiating the adhesive layer with ultraviolet light through the wafer; and a removal step of curving the support member and the double-sided adhesive tape and removing the support member and the double-sided adhesive tape from the wafer. |
