| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method capable of forming a flat horizontal face on the edge portion of a wafer.SOLUTION: In the polishing method of the invention, a pressing pad 51 is arranged at a position deviated by a predetermined distance in the tangential direction of a wafer W from the origin position on a center line extending radially from the center of a wafer W. The tangential direction is perpendicular to the center line. The wafer W is rotated, and a polishing tape 38 is pushed onto an edge portion of the wafer W by the pressing pad 51 existing at the deviated position so that a horizontal plane is formed on the edge portion of that wafer W. |
