METHOD OF TEMPORARILY OR PERMANENTLY ATTACHING MICROELECTRONIC DEVICES OR INTERPOSERS TO SUBSTRATE FOR MOUNTING, HANDLING OR TESTING AND COMPONENTS USEFUL THEREFOR

摘要

A method of attaching a microelectronic element 30 to a substrate 20 can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps 34 each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses 24 extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.